气候变化领域集成服务门户(CCPortal): On-chip higher-order topological micromechanical metamaterials

CCPortal

DOI	10.1016/j.scib.2021.06.024
	On-chip higher-order topological micromechanical metamaterials
	Wu Y.; Yan M.; Lin Z.-K.; Wang H.-X.; Li F.; Jiang J.-H.
发表日期	2021
ISSN	20959273
英文摘要	Metamaterials with higher-order topological band gaps that exhibit topological physics beyond the bulk-edge correspondence provide unique application values due to their ability of integrating topological boundary states at multiple dimensions in a single chip. On the other hand, in the past decade, micromechanical metamaterials are developing rapidly for various applications such as micro-piezoelectric-generators, intelligent micro-systems, on-chip sensing and self-powered micro-systems. To empower these cutting-edge applications with topological manipulations of elastic waves, higher-order topological mechanical systems working at high frequencies (MHz) with high quality-factors are demanded. The current realizations of higher-order topological mechanical systems, however, are still limited to systems with large scales (centimetres) and low frequencies (kHz). Here, we report the first experimental realization of an on-chip micromechanical metamaterial as the higher-order topological insulator for elastic waves at MHz. The higher-order topological phononic band gap is induced by the band inversion at the Brillouin zone corner which is achieved by configuring the orientations of the elliptic pillars etched on the silicon chip. With consistent experiments, theory and simulations, we demonstrate the emergence of coexisting topological edge and corner states in a single silicon chip as induced by the higher-order band topology. The experimental realization of on-chip micromechanical metamaterials with higher-order topology opens a new regime for materials and applications based on topological elastic waves. © 2021 Science China Press
关键词	Higher-order band topology Mechanical waves Micromechanical metamaterials On-chip devices
英文关键词	Elastic waves; Energy gap; Metamaterials; High-order; High-order band topology; Higher-order; Mechanical; Mechanical systems; Micro systems; Micro-mechanical; Micromechanical metamaterial; On chips; On-chip devices; Topology
语种	英语
来源期刊	Science Bulletin
文献类型	期刊论文
条目标识符	http://gcip.llas.ac.cn/handle/2XKMVOVA/207612
作者单位	School of Physics and Optoelectronics, South China University of Technology, Guangzhou, 510640, China; School of Physical Science and Technology, & Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou, 215006, China; School of Physical Science and Technology, Guangxi Normal University, Guilin, 541004, China; Key Lab of Advanced Optoelectronic Quantum Architecture and Measurement (MOE) and School of Physics, Beijing Institute of Technology, Beijing, 100081, China; Key Lab of Advanced Optical Manufacturing Technologies of Jiangsu Province & Key Lab of Modern Optical Technologies of Education Ministry of China, Soochow University, Suzhou, 215006, China
推荐引用方式 GB/T 7714	Wu Y.,Yan M.,Lin Z.-K.,et al. On-chip higher-order topological micromechanical metamaterials[J],2021.
APA	Wu Y.,Yan M.,Lin Z.-K.,Wang H.-X.,Li F.,&Jiang J.-H..(2021).On-chip higher-order topological micromechanical metamaterials.Science Bulletin.
MLA	Wu Y.,et al."On-chip higher-order topological micromechanical metamaterials".Science Bulletin (2021).