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DOI	10.1039/d0ee02490b
	Expression of interfacial Seebeck coefficient through grain boundary engineering with multi-layer graphene nanoplatelets
	Lin Y.; Wood M.; Imasato K.; Kuo J.J.; Lam D.; Mortazavi A.N.; Slade T.J.; Hodge S.A.; Xi K.; Kanatzidis M.G.; Clarke D.R.; Hersam M.C.; Snyder G.J.
发表日期	2020
ISSN	17545692
起始页码	4114
结束页码	4121
卷号	13 期号:11
英文摘要	Energy filtering has been a long-sought strategy to enhance a thermoelectric material's figure of merit zT through improving its power factor. Here we show a composite of multi-layer graphene nanoplatelets (GNP) and n-type Mg3Sb2 leads to the expression of an energy filtering like effect demonstrated by an increase in the material's Seebeck coefficient and maximum power factor, without impact on the material's carrier concentration. We analyse these findings from the perspective of a heterogeneous material consisting of grain and grain boundary phases, instead of a more traditional and common analysis that assumes a homogeneously transporting medium. An important implication of this treatment is that it leads to the development of an interfacial Seebeck coefficient term, which can explain the observed increase in the material's Seebeck coefficient. The contribution of this interfacial Seebeck coefficient to the overall Seebeck coefficient is determined by the relative temperature drop across the grain boundary region compared to that of the bulk material. In Te doped Mg3Sb2 we show the introduction of GNP increases the interfacial thermal resistance of grain boundaries, enhancing the contribution of the interfacial Seebeck coefficient arising from grain boundaries to the overall Seebeck coefficient. Without significant detriment to the electrical conductivity this effect results in a net increase in maximum power factor. This increased interfacial thermal resistance also leads to the synergistic reduction of the total thermal conductivity. As a result, we enhance zT of the Mg3Sb2 to a peak value of 1.7 near 750 K. Considering the two-dimensional nature of the grain boundary interface, this grain boundary engineering strategy could be applied to a few thermoelectric systems utilizing various two-dimensional nanomaterials. © The Royal Society of Chemistry.
英文关键词	Antimony compounds; Carrier concentration; Electric power factor; Grain boundaries; Graphene; Graphene Nanoplatelets; Magnesium compounds; Thermal conductivity; Electrical conductivity; Grain boundary engineering; Grain boundary interface; Heterogeneous materials; Interfacial thermal resistance; Thermo-Electric materials; Total thermal conductivities; Two dimensional nature; Seebeck coefficient; composite; electrical conductivity; grain boundary; interface; nanomaterial; thermal conductivity; two-dimensional modeling
语种	英语
来源期刊	Energy & Environmental Science
文献类型	期刊论文
条目标识符	http://gcip.llas.ac.cn/handle/2XKMVOVA/189488
作者单位	Department of Materials Science and Engineering, Northwestern UniversityIL 60208, United States; Cavendish Laboratory, University of Cambridge, Cambridge, CB3 0HE, United Kingdom; School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, United States; Department of Materials Science and Engineering, Monash University, Clayton, VIC 3800, Australia; Department of Chemistry, Northwestern UniversityIL 60208, United States; Versarien Plc, Cheltenham, GL51 9LT, United Kingdom; Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, CB3 0FS, United Kingdom
推荐引用方式 GB/T 7714	Lin Y.,Wood M.,Imasato K.,et al. Expression of interfacial Seebeck coefficient through grain boundary engineering with multi-layer graphene nanoplatelets[J],2020,13(11).
APA	Lin Y..,Wood M..,Imasato K..,Kuo J.J..,Lam D..,...&Snyder G.J..(2020).Expression of interfacial Seebeck coefficient through grain boundary engineering with multi-layer graphene nanoplatelets.Energy & Environmental Science,13(11).
MLA	Lin Y.,et al."Expression of interfacial Seebeck coefficient through grain boundary engineering with multi-layer graphene nanoplatelets".Energy & Environmental Science 13.11(2020).